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SoftSilicon for Flexible Packet Transport
sponsored by TPACK
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Posted:
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25 Jan 2008
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Published:
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01 Jan 2008
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Format:
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PDF
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Length:
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21
Page(s)
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Type:
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White Paper
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Language:
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English
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ABSTRACT:
A SOFTSYSTEM approach based on commercial SOFTSILICON chips provides TEMs with a standard solution that can accelerate time-to-market and reduce development cost. But since SOFTSILICON chips are based on programmable FPGAs, adaptation, customisation and even field upgrades are possible providing the flexibility that TEMs need to succeed today.
By using SOFTSILICON, TEMs address many of the issues they are facing today, but also open new opportunities as resources can be used more efficiently, the lifetime of system solutions in the field can be extended and new ideas can be market tested with lower cost and risk providing a platform for greater innovation and potential market leadership.
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