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Your request for Electronic Components resources returned limited or no results. The request has been expanded to include Operational Amplifiers, Diodes, Vacuum Tubes, Transistors, Oscillators, Integrated Logic Components, Electro-optical Devices, Electro-mechanical Devices, Discrete Component Packaging, Sensors, Resistors, Discrete Component Interconnection, Indicators, Inductors, Integrated Circuits and Capacitors resources.

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	Five Major Power Distribution Considerations for Data Center Racks sponsored by Avocent WHITE PAPER - Power densities and power consumption costs in data centers are rising. Learn what to consider when choosing the appropriate power distribution products at the rack level. Posted: February 11, 2008 \| Published: February 1, 2008 Topics: Capacitors \| Circuit Design \| Data Center Management \| Power Supplies \| Rack Enclosures \| Rack Servers

	BCM3341 BroadVoice™ VoIP Broadband IC sponsored by Broadcom Corporation PRODUCT OVERVIEW - The BroadVoice VoIP solution allows IP telephony equipment manufacturers and broadband DSL and cable service providers to economically offer a distinctly more advanced telephone service to consumers and businesses worldwide. Posted: August 8, 2004 \| Published: August 1, 2004 Topics: Cable Modems \| Integrated Circuits \| VoIP

	More Fingerprint Sensors Added to TI’s Flexible, Cost-efficient and Easy-to-Use Fingerprint Authentication Development Tool sponsored by Texas Instruments, Inc. PRESS RELEASE - TI's Fingerprint Authentication Development Tool (FADT). It includes all the software to get started plus the industry's first multi-platform, fingerprint sensor expansion boards with TI's DSP Starter Kits (DSKs). Posted: July 14, 2004 \| Published: July 1, 2004 Topics: Authentication \| Digital Signal Processors \| Fingerprinting \| Sensors \| Software Development Tools

	HyperTransport Bridge sponsored by GDA Technologies Inc. DATA SHEET - GDA's HyperTransport Bridge core, code named HyperBridge, is designed for reuse and it's flexible backend interface makes it easy to be integrated into wide range of applications. Posted: May 31, 2004 \| Published: June 1, 2002 Topics: Integrated Circuits \| IP Core

	HyperTransport Tunnel sponsored by GDA Technologies Inc. DATA SHEET - GDA's HyperTransport Tunnel core, code named HyperTunnel, is designed for reuse and it's flexible backend interface makes it easy to be integrated into wide range of applications. Posted: May 31, 2004 \| Published: June 1, 2002 Topics: Integrated Circuits \| IP Core

	HyperTransport Host sponsored by GDA Technologies Inc. DATA SHEET - GDA's HyperTransport Host core, code named HyperHost, is designed for reuse and it's flexible backend interface makes it easy to be integrated into wide range of applications. Posted: May 31, 2004 \| Published: June 1, 2002 Topics: Integrated Circuits \| IP Core

	HyperTransport Cave sponsored by GDA Technologies Inc. DATA SHEET - GDA's HyperTransport Cave core, code named HyperCave, is designed for reuse and it's flexible backend interface makes it easy to be integrated into wide range of applications. Posted: May 31, 2004 \| Published: June 1, 2002 Topics: Integrated Circuits \| IP Core

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