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| Your request for Electronic Components resources returned limited or no results. The request has been expanded to include Operational Amplifiers, Diodes, Vacuum Tubes, Transistors, Oscillators, Integrated Logic Components, Electro-optical Devices, Electro-mechanical Devices, Discrete Component Packaging, Sensors, Resistors, Discrete Component Interconnection, Indicators, Inductors, Integrated Circuits and Capacitors resources.
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PRODUCT LITERATURE: Posted: March 28, 2008 | Published: February 1, 2007
A network intrusion prevention solution typically consists of multiple sensors and this document gives general recommendations on sensor placement in a typical network.
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sponsored by Westcon - Nokia 
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SOFTWARE LISTING: Posted: March 27, 2008 | Published: March 1, 2008
This weather station warns of potentially damaging environmental changes and it is perfect for server room or remote computer room monitoring.
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sponsored by Peripheral Manufacturing. Inc. |
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WHITE PAPER: Posted: February 11, 2008 | Published: February 1, 2008
Power densities and power consumption costs in data centers are rising. Learn what to consider when choosing the appropriate power distribution products at the rack level.
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sponsored by Avocent 
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WHITE PAPER: Posted: July 11, 2006 | Published: January 1, 2003
Knowing the difference between Watts and Volt-Amps (VA) is crucial for UPS load sizing in data centers, but UPS vendors and manufacturers often use the terms interchangeably. Learn how to use these terms correctly in specifying power protection equipment.
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sponsored by APC 
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PRODUCT OVERVIEW: Posted: August 8, 2004 | Published: August 1, 2004
The BroadVoice VoIP solution allows IP telephony equipment manufacturers and broadband DSL and cable service providers to economically offer a distinctly more advanced telephone service to consumers and businesses worldwide.
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sponsored by Broadcom Corporation 
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PRESS RELEASE: Posted: July 14, 2004 | Published: July 1, 2004
TI's Fingerprint Authentication Development Tool (FADT). It includes all the software to get started plus the industry's first multi-platform, fingerprint sensor expansion boards with TI's DSP Starter Kits (DSKs).
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sponsored by Texas Instruments, Inc. 
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DATA SHEET: Posted: May 31, 2004 | Published: June 1, 2002
GDA's HyperTransport Bridge core, code named HyperBridge, is designed for reuse and it's flexible backend interface makes it easy to be integrated into wide range of applications.
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sponsored by GDA Technologies Inc. |
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DATA SHEET: Posted: May 31, 2004 | Published: June 1, 2002
GDA's HyperTransport Host core, code named HyperHost, is designed for reuse and it's flexible backend interface makes it easy to be integrated into wide range of applications.
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sponsored by GDA Technologies Inc. |
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DATA SHEET: Posted: May 31, 2004 | Published: June 1, 2002
GDA's HyperTransport Tunnel core, code named HyperTunnel, is designed for reuse and it's flexible backend interface makes it easy to be integrated into wide range of applications.
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sponsored by GDA Technologies Inc. |
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DATA SHEET: Posted: May 31, 2004 | Published: June 1, 2002
GDA's HyperTransport Cave core, code named HyperCave, is designed for reuse and it's flexible backend interface makes it easy to be integrated into wide range of applications.
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sponsored by GDA Technologies Inc. |
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